Automated Packaging of micro-optical Modules and Lasers

Nowadays many lasers and opto-electronical products are being offered robust, small, highly functional as well as cheaper and cheaper. The continuous further development of the packaging makes it possible. The packaging is the central production concept for micro-electronics and the micro-systems technology.

The spread of the automation builds the basis for developing new trends within the optoelectronic packaging. The high-volume markets more and more primarily are turning to miniaturization, system integration as well as new materials. The new techniques in turn put high requirements on the equipment manufacturers. Also for custom specific systems which are produced in small lots there are important developments in the field of bonding technologies, i.e. new gluing or soldering methods which have been improved for performance, handling, reliability, heating or costs.
The aim of the workshop is to specifically transport the R&D status of the packaging of laser and optoelectronic packaging from a user‘s point of view. It is targeted to developers and users in the fields laser packaging, optics, opto-electronics, and microsystem engineering.

Flyer

[28.10.2015 ]

Evening event  Dinner at Bootshaus Achim 20:00 hrs

[ 29.10.2015 ]

Welcome

• Dr.– Ing. Thomas Fahlbusch, PhotonicNet GmbH;  Torsten Vahrenkamp, ficonTEC Service GmbH

• Active alignment glues for minimizing shrinkingeffects; Maximilian Baum; DELO Industrie Klebstoffe GmbH & Co. KGaA, Windach

• CO₂-splicing and tapering of photonic high-power components; Dr.-Ing. Erik Beckert;Fraunhofer IOF, Jena

•  Chip on Board for optoelectronic applications; Siegmund Kobilke; Excelitas Technologies Elcos GmbH, Feldkirchen

• Integration of optical Tx/Rx-Elements for parallel optical links; Dr.-Ing. Krzysztof Nieweglowski; Institut für Aufbau- und Verbindungstechnik der Elektronic, Dresden

• Challenges for optical I/O in silicon photonics – the foundry perspective; Dr. Lars Zimmermann, IHP Innovations for High Performance Microelectronics, Frankfurt (Oder)

• Automation Processes for Silicon Photonics:a real case and some consideration on advanced coupling technologies; Dr. Giovanni Preve Inphotec center CNIT Center for photonic integrated technologies,  Pisa Italy

• Thin glass based photonic packaging on modul and PCB level; Dr. Henning Schröder Fraunhofer IZM, Berlin

• Assembling Laserdiodes and Photodiodes; Torsten Vahrenkamp ficonTEC Service GmbH, Achim

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