Wafer separation by using laser dicing as a crucial step in today’s semiconductor industry
Richard van der Stam, R&D Manager
ASM Pacific Technology, Vught, Niederlande
Over the last decade the traditional blade dicing technique for wafer separation is slowly being replaced by laser dicing. This technique gives many advantages, but brings also new challenges. Most pronounced is the continuously growing demand for minimizing the heat impact on the product, while keeping the productivity at a commercially attractive level. This asks for new concepts like multi-beam laser processing, separation based on volume modification instead of ablation and dicing with high power UV fs-lasers. In the presentation the current research as well as the outlook will be presented.
For more information, please visit https://www.wetzlar-network.de/de/termine/missionen-fuer-die-technologie-von-morgen
Datum
12.12.2022
18:15 Uhr
- 19 Uhr
Stadt
Gießen und online
Veranstaltungsort
Justus Liebig Universität Gießen Heinrich-Buff-Ring 14, 35392 Gießen, Deutschland Physikalische Institute, Hörsaal III
Referenten
Richard van der Stam, R&D Manager
ASM Pacific Technology, Vught, Niederlande
Veranstalter
Wetzlar Network
35573 Wetzlar
Telefon
06441 99-2051